BibTeX:

@article{IJIRSTV3I1103,
     title={Evaluation of Effective Thermal Conductivity in PCB},
     author={Vinod Nirale},
     journal={International Journal for Innovative Research in Science & Technology},
     volume={3},
     number={1},
     pages={174--179},
     year={},
     url={http://www.ijirst.org/articles/IJIRSTV3I1103.pdf},
     publisher={IJIRST (International Journal for Innovative Research in Science & Technology)},
}

PCB is made of composite materials. PCB consists of a sheet of insulating material, small holes are provided on this sheet for accommodating different components of the circuit to be assembled. A piece of base material on which components are mounted, an insulating material along with the bonding material covered with copper foil gives copper cladded laminates. A laminates is essentially a stack of lamina oriented in different directions, the term layup refers to the composition of laminate. Thermal analyzer are usually posed with the job of predicting the temperatures along and across the plane of PCB(thickness) to understand better effect of thermal gradients and stagnation of heat. The main requirement here is to determine the effective orthotropic physical properties of a copper cladded laminate (PCBs). The use of the “effective” implies properties of the entire laminate i.e. to evaluate effective thermal conductivity, density and specific heat of PCBs, but the in this paper its discussed only to evaluate the effective thermal conductivity.

Effective k in laminates, Electronic PCB, Bcond, Lux-pcb