BibTeX:

@article{IJIRSTV2I11061,
     title={Heat Transfer Enhancement Study for Electronic Cooling Application},
     author={Jefin Sunny, Geo Sebastian, Jobin Jose, Jithu S and Brutus Martin T},
     journal={International Journal for Innovative Research in Science & Technology},
     volume={2},
     number={11},
     pages={164--175},
     year={},
     url={http://www.ijirst.org/articles/IJIRSTV2I11061.pdf},
     publisher={IJIRST (International Journal for Innovative Research in Science & Technology)},
}

With the advancement of technology, cooling demands has gone up. In order to minimize cost, it is required to find out means to enhance heat dissipation rate without much design modification of electronic component. Here, analysis is carried out to optimize heat transfer in mixed convection regime to ensure minimum pumping power and channel size modifications. A vertical enclosure with a hot plate is considered and the flow is varied to obtain forced and mixed convection. The flow is considered to be laminar with Reynolds number below 2500 and Rayleigh number below. The orientation of the electronic component is also varied to determine the best possible design. Study was conducted by analysing the heat transfer coefficient of a hot plate using air flow. By comparing hot plate at different orientations, it is observed that the heat transfer coefficient value is high when the plate is inclined at an angle of 30 for both mixed and forced convection. It’s found out the power consumption is less in case of mixed convection. So by considering a limiting region were the heat transfer rate is similar for mixed and forced convection, we can choose mixed convection mode as the optimized convection mode.

Heat transfer coefficient, mixed convection, Vertical enclosure, pumping power